AIBRIEF
The AeroBlade, shown at IFA, a major European tech show, uses four Frore AirJet Mini G2 modules, each with ultrasonic vibrating membranes, to pull 30 watts of heat from a 10mm chassis.
Lenovo showed a 1.83-pound concept laptop at IFA Berlin that replaces the spinning fan with four solid-state cooling chips. The 14-inch prototype, code-named Project AeroBlade, uses four Frore Systems AirJet Mini G2 modules. Each is a 2.65 mm-thick chip that pulls heat off the CPU with piezoelectric membranes vibrating at ultrasonic frequencies, no moving air.
The four-module array pulls 30 watts of heat from the chassis, Tom's Hardware reports. Each AirJet Mini G2 is rated at 7.5 watts, so four modules quadruple the single AirJet Intel built into a Wildcat Lake reference design at Computex earlier in 2026. The chassis itself is 0.39 inches (10 mm) thick, on a magnesium-aluminum frame, with three USB-C/Thunderbolt 4 ports, an OLED display, and Wi-Fi 7.
The concept runs an Intel Lunar Lake processor (17-30 W TDP), though Tom's Hardware notes Lunar Lake is a placeholder. Newer Wildcat Lake or Panther Lake silicon in the same 15-35 W range would likely fit the same thermal envelope.
Lenovo also brought a second concept: Project Swan, a 3.5-pound notebook with a 14-inch rollable display that expands to 17 inches. Details on the rollable mechanism and shipping timing remain thin.