AIBRIEF
The Taoyuan based subsidiary has applied to open a Southern Taiwan Science Park branch with an R&D center for advanced packaging equipment.
Manz, the German equipment vendor behind the industry's first 310mm panel-level packaging (PLP) Electrochemical Deposition (ECD) mass-production system, has applied to open a Tainan Science Park branch with an R&D center for advanced-packaging equipment. The Southern Taiwan Science Park Bureau confirmed the application on August 5, according to Digitimes.
Advanced packaging is the back-end of chip production, where finished silicon dies are bundled into the modules that go on a circuit board. That step has become a capacity bottleneck for AI accelerators and HPC chips, and Tainan sits inside the same cluster that houses most of Taiwan's advanced-packaging output.
Manz Asia, the Taoyuan-based subsidiary, announced in June that it had delivered the world's first 310mm × 310mm panel-level ECD mass-production system to a customer line. The company's Omni X-series platforms cover 310mm, 510mm, and 700mm panel formats and target FOPLP, CoPoS, and TGV applications for AI, HPC, and advanced memory markets, per the company's news center.
CoPoS — Chip-on-Panel-on-Substrate — is the panelized evolution of CoWoS, the advanced packaging flow that currently throttles AI accelerator output. A Tainan R&D seat would put Manz next to the customers and lines it is already trying to supply.
The bureau's confirmation is an application, not an approved project. Deal value, headcount, customer targets, and a timeline for the Tainan R&D center remain unconfirmed pending direct bureau or Manz-side disclosure.