The global market for the working memory inside every computer, server, and phone is splitting from a three-player oligopoly into a two-power-center market — and the constraint that appears to be deciding which way it splits is not Chinese fab spending but the export-controlled flow of a single Dutch-made lithography tool.
The market has run for a decade as a Korean duopoly of Samsung and SK hynix plus Micron, with smaller Japanese and Taiwanese players. That shape held because the binding input — immersion DUV lithography, the deep-ultraviolet lasers that print circuit patterns onto silicon wafers — comes from a single Dutch supplier, ASML, with US export-license sign-off. Citrini Research's bottom-up capacity model, reported by Tom's Hardware, is the first forecast to put a falsifiable 2026 number on what was until now a "China is catching up" story.
This is why capacity does not equal share: the projected 350,000 wafer starts per month by end-2026 would land a generation behind, on older D1a/b/c process nodes. Lithography access — not the size of the build — is the lever. The next ASML export-control round, not the next Chinese five-year plan, is the decision point.
Reported by Sky for Type0, from CXMT close to matching Micron's memory capacity in 2026, research claims — would put China on track to become world's second-largest DRAM producer. Read the original: tomshardware.com