Shanghai Aishengna is publicly linked to the deep ultraviolet lithography scanner, with a 2038 target for a 7nm capable system, while the light sensitive photoresist chemicals, the wafer handling coater/developer tracks, and the excimer
Shanghai Aishengna Electronic Technology Group was named this week as the state-owned maker of China's first homegrown immersion DUV lithography scanner, the deep-ultraviolet light-based machine that prints the smallest features onto silicon wafers inside an advanced fab (Reuters via Tom's Hardware). Aishengna was established in August 2023 with about 7 billion yuan in registered capital, roughly $1 billion at the time, and is thought to have absorbed engineering teams from Shanghai Yuliangsheng Technology and Shanghai Micro Electronics Equipment (SMEE) (Reuters; Baidu Baike company entry). Both SMEE and Yuliangsheng declined to comment on the absorption.
The attribution comes from a single unnamed source, which Reuters carried as such. Aishengna is now publicly identified as the maker; whether it can deliver a production-ready scanner is a different question. The headline figure that followed the Reuters scoop, a 2038 target for the first viable domestic 7nm-capable scanner, is a program horizon, still short of a ship date (Kathmandu Post republishing Reuters).
An immersion DUV cluster is six mechanically and thermally matched pieces: the scanner itself, the photoresist that records the pattern, the coater/developer track that applies and strips the resist, the excimer laser light source, the metrology that aligns the layers, and the photomask. China is at different maturity in each, and the scanner is the most advanced of the six on the available evidence.
On photoresist, Chinese suppliers hold under 1% of the ArF immersion segment specifically, while JSR, Tokyo Ohka Kogyo, Shin-Etsu Chemical, and Fujifilm combined for 72.5% of the broader ArF photoresist market (Techwire Asia). The chairman of Xuzhou B&C Chemical, Fu Zhiwei, told the same outlet that mass production of China's core advanced resists is roughly five years out. Nata Opto-electronic in Hefei built a 25-ton ArF line, later scaled to 50 tons, that qualified in December 2020 and cleared project acceptance in 2024, but volumes remain small. Photoresist is the light-sensitive chemical that records the circuit pattern; the ArF immersion grade, used at a 193-nanometer wavelength with the wafer submerged in water to sharpen the focal spot, is the version a 7nm-capable scanner would require.
On coater/developer tracks, the machines that handle the wafer between exposures, Tokyo Electron held 89% of the global market in 2022 on the company's own disclosures, and the Tokyo Electron CEO has said the company holds close to 100% of EUV production (Techwire Asia). Shenyang Kingsemi has reached 28nm-class track capability and is targeting 14nm. A 28nm-class track can pattern supporting layers for a 7nm-class flow, but it isn't a match for the leading-edge wafer path; the track and the scanner have to keep up with each other or throughput collapses.
On excimer lasers, the deep-ultraviolet light sources that fire millions of pulses per wafer, Cymer, Gigaphoton, and Coherent together held more than 80% of the ArF excimer laser market. Cymer has been an ASML subsidiary since 2013. Beijing RSLaser shipped China's first high-power domestic ArF excimer laser in 2018 under a national project, a useful first step, still years from a production base at ASML scale.
First deliveries from the Aishengna program are slated for SMIC, Hua Hong Semiconductor, and ChangXin Memory Technologies, the three Chinese foundries and memory makers with the most advanced process roadmaps. SMIC has been testing a Yuliangsheng immersion tool since September 2025 (Electronics Weekly), so the new scanner will be measured against that field experience. Yuliangsheng is targeting five immersion DUV machine shipments this year.
Industrial-policy coordination could compress the resist, track, and laser gaps faster than the 2022-vintage market-share snapshots suggest, and that is the strongest counterargument. The reader can falsify the "stack is years behind" case with three concrete signals: a domestic ArF immersion resist qualified at production volume, a Kingsemi 14nm-class track shipping before 2028, and a second-generation RSLaser light source at sustained high power. Until any of those land, the Aishengna scanner is a named program with a 2038 horizon, still short of a delivered capability.